PCTuning fórum

oneb1t píše:jsem zvedavej jak je to vyreseny kazdopadne 6 fazi u AM3 utahlo 225W CPUcka takze to by mohlo stacit i na slusny OC u ryzenu

AMD's new sockets FM1 and FM2 work differently; the GPU portion of the APU shares the voltage & power phase with the CPU portion. Therefore power phase work as the usual 4+1/8+2/etc on other AMD boards (CPU/GPU + IMC), not 4+1+1 as on Intel boards.

BudyCZ píše:Tuší už někdo jak to bude vypadat s režimem XFR u "X" variant?
XFR se bude vstahovat pouze na base/turbo takty a nebo může mít i zásadní vliv na max OC?
Zrovna spekuluji nad otázkou jak to bude ohledně OC... Jestli s 1800X dosáhneme vyššího OC a nebo to bude plichta a dávat o x tisíc více za Xko se neoplatí.
Ostatně 1700 vypadá super za ty peníze a snad by mohl jít stejně dobře taktovat jako 1800X? Co myslíte?

oneb1t píše:doufam ze u procesoru bez grafiky se pouzije vsech 9 pro napajeni CPU a nebudou se 3 flakat

Dithius píše:Skvělé. teď ještě poslední věc. aby vyšly desky osekane o Videovystupy, respektive desky ktere budou dělané jako určene pro ryzeny a do nichž nebude zaměrem dát APU. štve mě že bych měl mít ryzena a desku s nevyužitelnými výstupy.

After having a discussion about AM4 motherboards, it soon became obvious what kind of changes to the design the common socket and 14nm LPP process makes.

It is obvious that even the cheapest AM4 boards will be quite a lot more expensive than the cheapest AM3+ or FM2+ boards were. Unless AMD really starts to audit / enforce the design guidelines on AM4 motherboards, the consumers will be in a world of pain.

Zen appears to operate at very low voltage levels (even in relation to Intel 14nm parts) and because of that draw rather high amounts of current in relation to the power consumption. The increase in current draw is obvious as the process size goes down (lower voltage, P = I * V), however the actual increase appears to be a bit more than I personally anticipated. This means that the VRM(s) on the motherboards must be even tougher than on AM3+ motherboards. Because of the common socket (CPU & APU) the secondary VRM must be extremely beefy too. I would estimate the high-end boards should have 4 phase "SoC"-plane VRM (feeds the CNB and the iGPU) in order to be on the safe side. On AM3+ or FM2+ platforms 2-phase secondary VRM plane is the standard, even on high-end boards.

Naturally it is possible to make a Zen CPU targeted motherboards with restrictions applied on APU compatibility, in order to save on the cost. However a fully CPU & APU compatible high-end AM4 board will be expensive because of the VRM alone.
#615The Stilt, Apr 3, 2016